Company Overview






About ASE Shanghai
ASE Shanghai (ASESH), previously named Global Advanced Packaging Technology Co., LTD (GAPT), is a member of ASE Group.

ASESH provides semiconductor industry with integral ability of IC design, assembly & testing, wafer probing and final test. And, we provide an excellent one stop shop service for both domestic and global customers.

ASESH's main package offerings include BGA, CSP, and QFP featuring traditional wire bonding and advanced fine pitch technology. Our test technology supports all types of testing, and encompasses analog, logic, and mixed signal. In addition, ASESH also provides test development software and services for customers.

Strategically located in Shanghai's Zhangjiang High-Tech park, ASESH benefits our customers by our proximity to key wafer foundries, which enables the company to serve both fabless companies and integrated device manufacturers (IDMs). With technologies to meet applications slated for the expanding consumer, computer, and communications markets, ASESH is one of the leading providers of one-stop solution services in China.


Milestone
2000.12 Global Advanced Packaging Technology Ltd (GAPT) Registered in Shanghai, China
2001.12 PBGA Package Mass Production
2002.06 QFP Package Mass Production
2003.01 LFBGA Package Mass Production
2003.04 ISO9001/QS9000/ISO14000 Certified
2004.04 TS16949 Certified
2004.11 Strategic Alignment with ASE Group
2005.01 OHSAS18001 Certified
2007.11 Integrated with ASE Group and Rename as ASE Assembly & Test (Shanghai) Ltd.
2008.01 SO/PDIP Package Mass Production
2008.03 Sony Green Partner Certified
2008.06 QC080000 Certified
2008.07 QFN Package Mass Production
2009.03 Cu Wire Production Release
2013.10 Mini-QFN Package Mass Production




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