Quad


QFP
T/LQFP


Overview
 
Quad packages have been used for years in ASICs, DSPs, microcontrollers, and memory ICs. A wide range of open and closed tools in quad packages offer low cost and reliable solutions for moderate and low pin ICs. Several state-of-the-art improvements on thermal and electrical issues concerning quad packages have been proposed and introduced, including MCM. To meet the requirements of compact and low profi le electronic devices, quad packages as thin as 1.1mm are offered at ASE.



For more information, please contact ASE sales office.
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